Sandia develops innovative microsystem integration solutions to support Sandia's National Security Mission and its Strategic Business Units.
The Advanced Micro- systems Packaging organization develops technologies that support the delivery of integrated microsystems to a diverse customer base with components from Sandia's microsystems organizations and commercial suppliers.
Our activities involve
- deliveryof new packaging technologies required to integrate a diverse set of components
- advanced photonics
- rf devices
- analog and digital integrated circuits
Our six major thrust areas are listed below.
- 3D Packaging
- MEMS Packaging
- Thermal Management & Microfluidic Technologies
- Advanced MCM Technology
- COTS/PEMS Reliability
- Rapid Hybrid Prototyping
It is critical for Sandia to develop ways of integrating these dissimilar technologies to deliver microsystems needed for our mission of national security.
High capability, small volume packaging solutions are necessary to microsystems.
Diagram illustrating the 32 layer 3-D package
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Advanced packaging integrates MEMS into microsystems.
We apply thermal management through passive and active cooling technologies for high power, low volume applications.
Model of thermal activity
Advanced MCM Technology
Advanced MCM Technology integrates high density interconnection for maximum performance in multi-chip modules.
Active cooling built into MCM technology
A challenge we face is determining the reliability and risks associated with using commercial-off-the-shelf, plastic-encapsulated microelectronics.
Rapid Hybrid Prototyping
We provide packaging solutions from prototyping to WR-certification for a wide range of products.